Semiconductor module bonding structure and bonding method

A semiconductor module bonding method for bonding a plate-shaped power terminal, being electrically connected to a semiconductor element, and a plate-shaped bonding part of a bus bar together in a semiconductor module, the semiconductor module bonding method comprising the steps of:

• preparing the semiconductor module and the bus bar such a width of a one of the power terminal or the bonding part that has the smaller thickness is larger than a width of the other one of the power terminal or the bonding part that has the larger thickness, and the bus bar includes a through-hole configured so that an opening size in the thickness direction of the power terminal has a smallest portion at a portion corresponding to the bonding part;
• and
• bonding, in the semiconductor module and the bus bar prepared in the preparing step, boundary portions of the power terminal and the bonding part together by fusion welding in a state where the power terminal and the bonding part are arranged in contact with each other such that the thickness directions of the power terminal and the bonding part are orthogonal to each other, wherein the bonding part includes a projection that is arranged projecting along a thickness direction of the power terminal,
• the bonding further including forming a welded part by the fusion welding at a boundary portion between the power terminal and the bonding part, and extends outward, from a narrow portion that is a smallest portion of the opening of the through-hole, along the thickness direction of the power terminal,
• wherein the power terminal is offset from a central axis of the through-hole such that the narrow portion of the through hole is provided so as to form a gap between a first side of the power terminal and the projection, the first side of the power terminal being a side of the power terminal that faces the projection, while the power terminal directly contacts the welded part at a second side of the power terminal opposite to the first side.