Wiring board having each pad with tapered section continuously formed on columnar section

A wiring board comprising:

• a first insulating layer having a first surface that forms a semiconductor chip mounting surface;
• an external connection surface provided on an opposite side from the semiconductor chip mounting surface;
• and
• a plurality of pads provided on the semiconductor chip mounting surface,
• wherein each pad of the plurality of pads includes
• a columnar section having a first end, a second end opposite to the first end, a first portion embedded in the first insulating layer, and a second portion connected to the first portion and projecting from the first surface, and
• a tapered section, continuously formed on the first end of the columnar section, and having a cross sectional area that decreases from a third end toward a fourth end, opposite to the third end, in a direction away from the columnar section,
• wherein the second portion has a projecting tip end forming the first end,
• wherein the tapered section of each pad of the plurality of pads is continuously formed on the projecting tip end of the second portion and projects from the semiconductor chip mounting surface, and
• wherein a cross sectional area of the columnar section at the first end thereof has a shape and a size identical to a shape and a size of the cross sectional area of the tapered section at the third end thereof.