Semiconductor device, lead frame, and method for manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorNaoki Saegusa
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor device that can improve yield and non-defective rate by obtaining the thickness of a melt-bonding material and suppressing inclination of a circuit board. The semiconductor device includes a circuit board including a circuit pattern layer, a semiconductor element mounted on the circuit board, a melt-bonding portion arranged on an upper surface of the circuit pattern layer, a bonding lead including a bonding portion facing the upper surface of the circuit pattern layer and electrically connected to the circuit pattern layer via the melt-bonding portion, and a pressing portion directly contacted with an upper surface of the circuit board.
Claims16
A semiconductor device comprising:
- a circuit board including a circuit pattern layer;
- a semiconductor element mounted on the circuit pattern layer;
- a melt-bonding material arranged on a part of an upper surface of the circuit pattern layer;
- and
- a connection terminal group formed by including a plurality of leads including a bonding portion electrically connected to the circuit pattern layer via the melt-bonding material and a pressing portion mechanically and directly contacted with an upper surface of the circuit board at a location spaced apart from the semiconductor element in a width direction of the circuit board, the upper surface of the circuit board being located below a bottom surface of the semiconductor element.
A lead frame to be bonded to a circuit board on which a semiconductor element is mounted, the circuit board including a circuit pattern layer, and the lead frame comprising:
- a connection terminal group formed by including a plurality of leads including a bonding portion to be electrically connected to the circuit pattern layer via a melt-bonding material and a pressing portion to be mechanically and directly contacted with an upper surface of the circuit board at a location spaced apart from the semiconductor element in a width direction of the circuit board, the upper surface of the circuit board being located below a bottom surface of the semiconductor element;
- and
- a frame portion configured to support the connection terminal group,
- wherein, in the connection terminal group, the plurality of leads are adjusted in shape such that when the pressing portion is in direct contact with the upper surface of the circuit board, there is a gap between the bonding portion and the circuit pattern layer.
A method for manufacturing a semiconductor device comprising:
- preparing a circuit board including a circuit pattern layer and an insulated plate;
- mounting a semiconductor element on the circuit board;
- applying a melt-bonding material on a part of an upper surface of the circuit pattern layer;
- arranging, above the circuit board, a lead frame including a connection terminal group formed by including a plurality of leads including a bonding portion to be electrically connected to the circuit pattern layer via the melt-bonding material and a pressing portion to be mechanically and directly contacted with an upper surface of the circuit board at a location spaced apart from the semiconductor element in a width direction of the circuit board, the upper surface of the circuit board being located below a bottom surface of the semiconductor element;
- arranging the lead frame such that the pressing portion presses the insulated plate included in the circuit board to form a gap between the bonding portion and the circuit pattern layer;
- and
- melting the melt-bonding material.
Dependencies are inferred from the claim text.