Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device

A method, comprising:

• molding a laser direct structuring material onto at least one semiconductor chip which is mounted on a leadframe, the molded laser direct structuring material providing at least one portion of an insulating package for the at least one semiconductor chip, the at least one portion of the insulating package having an outer surface;
• providing at least one electrically conductive formation extending between the outer surface of the at least one portion of the insulating package and the at least one semiconductor chip, wherein providing the at least one electrically conductive formation comprises:
• forming an opening extending through the molded laser direct structuring material to expose at least one contact of said at least one semiconductor chip;
• and
• filling the opening with an electrically conductive material;
• providing a mounting paddle on the outer surface of the at least one portion of the insulating package and in contact with said at least one electrically conductive formation;
• and
• applying an electrically conductive clip onto the mounting paddle at the outer surface of the at least one portion of the insulating package, said electrically conductive clip being electrically coupled to said at least one semiconductor chip through the at least one electrically conductive formation;
• and
• electrically connecting the electrically conductive clip to the leadframe, with the at least one semiconductor chip located intermediate the leadframe and the electrically conductive clip.