Back to results
US 11,145,581 B2Granted
Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
AssigneeSemiconductor Components Industries, LLC
InventorsDarrell D. Truhitte, James P. Letterman, Jr.
Life of this patent
Estimating the term…
Abstract
A leadless package with wettable flanks is formed by providing a substrate and plating a metal layer onto the substrate to form a contact on the substrate extending across a saw street. An encapsulant is deposited over the contact. The substrate is removed to expose the contact and encapsulant. The encapsulant and contact are singulated. In some embodiments, the substrate includes a ridge, and the contact is formed over the ridge.
Claims8
A semiconductor device comprising:
- an electrical contact comprising a first side and a second side opposite the first side;
- and
- an encapsulant directly coupled to the second side of the electrical contact;
- wherein the first side of the electrical contact is exposed on a first side of the semiconductor device;
- and
- wherein, at a sidewall of the semiconductor device, a length of the electrical contact linearly slopes towards a second side of the semiconductor device opposite the first side of the semiconductor device, the sidewall of the semiconductor device extending between the first side of the semiconductor device and the second side of the semiconductor device.
3 more elements
A semiconductor device comprising:
- a first side;
- a second side opposite the first side of the semiconductor device;
- a sidewall that extends between the first side of the semiconductor device and the second side of the semiconductor device;
- an electrical contact comprising:
- a first side comprising a bottom portion and a wettable flank;
- and
- a second side opposite the first side;
- and
- wherein the bottom portion of the electrical contact is exposed on the first side of the semiconductor device and the wettable flank extends along the sidewall at an oblique angle relative to a plane formed by the bottom portion;
- and
- an encapsulant directly coupled to the second side of the electrical contact.
8 more elements
Dependencies are inferred from the claim text.