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US 11,145,580 B1Granted
IoT and AI system package with solid-state battery enhanced performance
AssigneeInternational Business Machines Corporation
InventorsFrank Robert Libsch, Stephen W. Bedell, Ning Li
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Abstract
An energy storage device for an integrated circuit carrier package. One or more energy storage elements have contact elements arranged thereon that include an anode, a cathode, and an isolated common pad. The energy storage element is configured for arrangement in a stack of energy storage elements in which the isolated common pad is shorted to one of the anode or the cathode by bonded conductive interconnects.
Claims20
An energy storage device, comprising:
- an energy storage element having contact elements arranged thereon including an anode pad, a cathode pad, and at least one isolated common pad;
- wherein the energy storage element is configured for stacking by symmetrically arranging the anode pad, cathode pad and the isolated common pad along a perimeter of the energy storage element and by shorting the isolated common pad to one of the anode or the cathode by bonded conductive interconnects.
A integrated circuit carrier package, comprising:
- a silicon carrier;
- a smart chip electrically connected to the silicon carrier;
- an I/O device electrically connected to the silicon carrier;
- a plurality of aligned and bonded energy storage elements, including at least one pass-through isolated connection to the smart chip and the I/O device, and contact elements arranged on each of the storage elements comprising an anode, a cathode, and an isolated common pad;
- and
- a multi-signal electrical flexible cable arranged to connect the silicon carrier and the respective anode and the cathode of each the plurality of energy storage elements,
- wherein the plurality of energy storage elements are arranged in a stack in which the isolated common pad is connected to the multi-signal electrical flexible cable and shorted to one of the anode or the cathode by bonded conductive interconnects.
4 more elements
A method of multichip assembly, the method comprising:
- aligning and bonding a plurality of first conductive interconnects to at least a first integrated circuit chip and a second integrated circuit chip;
- arranging a plurality of energy storage elements in a stack,
- aligning and bonding a plurality of second conductive interconnects to the plurality of energy storage elements and to at least one of the first integrated circuit chip and the second integrated circuit chip, wherein the plurality of energy storage elements include an anode, a cathode, and an isolated common pad;
- and
- electrically connecting the isolated common pad cable by shorting one of the anode or the cathode with the isolated common pad.
2 more elements
Dependencies are inferred from the claim text.