Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package

A method of producing a package, the method comprising:

• attaching a second load terminal at a second side of a semiconductor die to a metal block which provides a single primary thermal conduction path of the package, the semiconductor die having a first load terminal at a first side of the semiconductor die opposite the second side;
• electrically connecting a first metal lead to the first load terminal of the semiconductor die;
• electrically connecting a second metal lead to the second load terminal of the semiconductor die;
• and
• embedding the semiconductor die, the metal block, the first metal lead and the second metal lead in a mold compound,
• wherein the first metal lead, the second metal lead and the metal block are exposed from the mold compound at a first side of the package,
• wherein the first metal lead and the second metal lead are exposed from the mold compound at a second side of the package opposite the first side, so that the package is configured for surface mounting at either the first side or the second side of the package.

An electronic assembly, comprising:

• a package comprising:
• a semiconductor die having a first load terminal at a first side of the semiconductor die and a second load terminal at a second side of the semiconductor die opposite the first side;
• a metal block attached to the second load terminal of the semiconductor die and providing a single primary thermal conduction path of the package;
• a first metal lead electrically connected to the first load terminal of the semiconductor die;
• a second metal lead electrically connected to the second load terminal of the semiconductor die;
• and
• a mold compound embedding the semiconductor die, the metal block, the first metal lead and the second metal lead,
• wherein the first metal lead, the second metal lead and the metal block are exposed from the mold compound at a first side of the package,
• wherein the first metal lead and the second metal lead are exposed from the mold compound at a second side of the package opposite the first side, so that the package is configured for surface mounting at either the first side or the second side of the package;
• and
• a substrate to which the package is surface mounted at either the first side or the second side of the package.