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US 11,145,577 B2Granted
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
AssigneeIntel Corporation
InventorsSonja Koller, Georg Seidemann, Reinhard Mahnkopf, Bernd Waidhas
Life of this patent
Estimating the term…
Abstract
A system-in-package apparatus includes a square wave lead frame that provides a recess for a first semiconductive device as well as a feature for a second device. The system-in-package apparatus includes a printed wiling board that is wrapped onto the lead frame after a manner to enclose the first semiconductive device into the recess.
Claims20
A system-in-package apparatus comprising:
- a lead frame including a first recess therein and a feature;
- a printed wiring board (PWB) in contact with the lead frame, wherein the PWB spans the first recess, and wherein the PWB exhibits an angular fold in contact with the lead frame;
- a first semiconductive device disposed on the PWB and in the first recess;
- and
- a subsequent device disposed on the PWB and in the feature, wherein the first semiconductive device and the subsequent semiconductive device do not electrically interact with the lead frame.
2 more elements
A system-in-package apparatus comprising:
- an electrically inactive lead frame including a first angular deflection and a second angular deflection, wherein the lead frame includes a first planar section adjacent the first angular deflection, and including a second planar section set apart from the first planar section by the second angular deflection;
- a printed wiring board (PWB) in contact with the lead frame, wherein the PWB spans the second angular deflection and exhibits an angular fold in contact with the lead frame;
- and
- a first semiconductive device disposed on the PWB and between the first angular deflection and a second angular deflection.
1 more element
A computing system including a system-in-package apparatus comprising:
- an electrically inactive lead frame including a first recess therein and a feature;
- a printed wiring board (PWB) in contact with the lead frame, wherein the PWB spans the first recess, and wherein the PWB exhibits an angular fold in contact with the lead frame;
- a first semiconductive device disposed on the PWB and in the first recess;
- a subsequent device disposed on the PWB and in the feature;
- and
- wherein a portion of the PWB includes an external shell for the computing system.
3 more elements
Dependencies are inferred from the claim text.