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US 11,145,571 B2Granted
Heat transfer for power modules
AssigneeSemiconductor Components Industries, LLC
InventorsInpil Yoo, Jerome Teysseyre, Seungwon Im, Dongwook Kang
Life of this patent
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Abstract
In one general aspect, an apparatus can include a substrate, a semiconductor die coupled with a first surface of the substrate, and a metal layer disposed on a second surface of the substrate. The second surface can be opposite the first surface. The apparatus can also include a plurality of metal fins coupled with the metal layer, and a metal ring coupled with the metal layer. The metal ring can surround the plurality of metal fins.
Claims20
An apparatus, comprising:
- a direct bonded metal (DBM) substrate including an insulator layer;
- a semiconductor die coupled with a first side of the insulator layer;
- a direct-bonded metal layer disposed on a second side of the insulator layer, the second side being opposite the first side;
- a plurality of metal fins directly coupled with the direct-bonded metal layer;
- and
- a metal ring coupled with the direct-bonded metal layer, the metal ring surrounding the plurality of metal fins.
3 more elements
An apparatus, comprising:
- a semiconductor die;
- a direct-bonded-metal substrate, the semiconductor die being coupled with a first side of an insulator layer of the direct-bonded-metal substrate;
- a direct-bonded metal layer disposed on a second side of the insulator layer, the second side being opposite the first side;
- a plurality of metal fins that are active metal brazed directly to the direct-bonded metal layer;
- and
- a metal ring that is active metal brazed with the direct-bonded metal layer, the metal ring surrounding the plurality of metal fins.
3 more elements
A method for forming a module, the method comprising:
- coupling a semiconductor die with a first side of an insulator layer of a direct-bonded metal (DBM) substrate;
- directly coupling a plurality of metal fins with a metal layer of the DBM substrate, the metal layer being disposed on a second side of the insulator layer;
- and
- coupling a metal ring with the metal layer, the metal ring surrounding the plurality of metal fins.
1 more element
Dependencies are inferred from the claim text.