Method of fabricating a chip package module with improve heat dissipation effect

A manufacturing method of chip package module with heat dissipation function, comprising:

• providing a temporary carrier having an alignment pattern, wherein the temporary carrier includes a base and a peelable adhesive material disposed on the base;
• disposing a circuit board on the temporary carrier according to the alignment pattern, wherein the circuit board has a chip accommodating space passing therethrough;
• disposing a chip with an active surface thereof facing the temporary carrier in the chip accommodating space according to the alignment pattern, wherein the chip is fixed on the temporary carrier by the peelable adhesive material;
• filling the chip accommodating space with a molding material so that the chip is connected to and fixed on the circuit board, and an initial package structure is therefore formed;
• separating the initial package structure from the temporary carrier, wherein a bottom surface of the chip is exposed from a bottom side of the initial package structure;
• and
• forming an electrically and thermally conductive layer at the bottom side of the initial package structure, wherein the electrically and thermally conductive layer is in direct contact with the bottom surface of the chip and covers the bottom surface of the chip.