Package structure and method of manufacturing the same

A package structure, comprising:

• a circuit substrate;
• an interposer disposed on and electrically connected to the circuit substrate, wherein the interposer comprises a first substrate and a through via embedded in the first substrate, and the through via is in physical contact with the first substrate;
• a first underfill layer, disposed to fill a space between the interposer and the circuit substrate;
• a die disposed on and electrically connected to the interposer, wherein the die comprises a second substrate;
• and
• a second underfill layer, disposed to fill a space between the die and the interposer.

A method of manufacturing a package structure, comprising:

• bonding a die to a wafer, wherein the wafer comprises a semiconductor substrate and an interconnection structure on the semiconductor substrate;
• removing the semiconductor substrate to expose a conductive feature of the interconnection structure;
• forming a conductive post on the conductive feature;
• forming an encapsulant to laterally encapsulate the conductive post, and an interposer comprising the encapsulant, the conductive post and the interconnection structure is formed, the interposer is electrically connected to the die;
• and
• forming a conductive terminal to electrically connect to the conductive post of the interposer.