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US 11,145,534 B2Granted
Support unit and substrate treating apparatus comprising the same
AssigneeSemes Co., Ltd.
InventorsSeung Pyo Lee, Hyung Joon Kim
Life of this patent
Estimating the term…
Abstract
Disclosed are a support unit and a substrate treating apparatus comprising the same. The inventive concept provides a support unit that may prove temperature uniformity between facing areas on a substrate the other areas of the substrate and may solve a problem of not easily separating a substrate by a negative pressure in a pin hole when the substrate is separated from the support unit, and a substrate treating apparatus.
Claims10
A substrate treating apparatus comprising:
- a chamber providing a treatment space to the interior of the substrate treating apparatus;
- a support unit located in the treatment space and on which a substrate is positioned;
- a gas supply unit configured to eject a process gas into the treatment space;
- and
- a plasma generating unit configured to generate plasma from the process gas,
- wherein the support unit comprises:
- a lift pin configured to elevate through a pin hole formed in the support unit and configured to deliver the substrate to the support unit or receive the substrate from the support unit;
- a gas line formed in the support unit to supply a heat transfer gas between the substrate positioned on the support unit and the support unit, the gas line extending through the support unit to an upper surface of the support unit and separated from the lift pin and pin hole, the gas line formed to supply the heat transfer gas to a space between a bottom surface of the substrate and the upper surface of the support unit;
- and
- a supply line configured to supply the heat transfer gas to the pin hole,
- wherein the support unit comprises:
- an electrostatic chuck configured to suction the substrate by an electrostatic force;
- an electrode plate disposed below the electrostatic chuck, the electrode plate comprising a plurality of refrigerant passages;
- an insulation plate disposed below the refrigerant passages of the electrode plate;
- and
- wherein the supply line is branched from the gas line in the insulation plate and is connected to the pin hole in the insulation plate.
13 more elements
A support unit that supports a substrate, the support unit comprising:
- a lift pin configured to elevate through a pin hole formed in the support unit and configured to deliver the substrate to the support unit or receive the substrate from the support unit;
- a gas line formed in the support unit to supply a heat transfer gas to a space between a bottom surface of the substrate positioned on the support unit and an upper surface of the support unit, the gas line extending through the support unit to the upper surface of the support unit and separated from the lift pin and pin hole;
- and
- a supply line configured to supply the heat transfer gas to the pin hole,
- wherein the support unit comprises:
- an electrostatic chuck configured to suction the substrate by an electrostatic force;
- an electrode plate disposed under the electrostatic chuck, the electrode plate comprising a plurality of refrigerant passages;
- and
- an insulation plate disposed below the refrigerant passages of the electrode plate,
- wherein the gas line is configured to pass thorough the electrostatic chuck, the electrode plate, and the insulation plate,
- wherein the lift pin is configured to elevate through a pin hole extending from the electrostatic chuck to the insulation plate in the interior thereof, and
- wherein the supply line is branched from the gas line in the insulation plate and is connected to the pin hole in the plate.
9 more elements
Dependencies are inferred from the claim text.