Substrate fixing device
AssigneeShinko Electric Industries Co., Ltd.
InventorKazuhiro Fujita
Life of this patent
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Abstract
A substrate fixing device includes a baseplate, an adhesive layer on the baseplate, and an electrostatic chuck on the adhesive layer. The adhesive layer includes a first layer and a second layer. The second layer is between the first layer and the electrostatic chuck. The thermal conductivity of the first layer is higher in a stacking direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked than in a plane direction perpendicular to the stacking direction. The thermal conductivity of the second layer is higher in the plane direction than in the stacking direction.
Claims9
A substrate fixing device comprising:
- a baseplate;
- an adhesive layer on the baseplate;
- and an electrostatic chuck on the adhesive layer, wherein the adhesive layer includes a first layer and a second layer, the second layer being interposed between the first layer and the electrostatic chuck, wherein a thermal conductivity of the first layer in a stacking direction is higher than a thermal conductivity of the first layer in a plane direction, the stacking direction being a direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked, the plane direction being perpendicular to the stacking direction, wherein a thermal conductivity of the second layer in the plane direction is higher than a thermal conductivity of the second layer in the stacking direction, and wherein the second layer includes a resin;
- and a carbon sheet in the resin, the carbon sheet including main surfaces parallel to the plane direction, wherein the resin directly covers each of the main surfaces of the carbon sheet;
- wherein the second layer is thinner than the first layer.
A substrate fixing device comprising:
- a baseplate;
- an adhesive layer on the baseplate;
- and an electrostatic chuck on the adhesive layer, the electrostatic chuck including a substrate and a heating element buried in the substrate, wherein the adhesive layer includes a first layer and a second layer, the second layer being between the first layer and the electrostatic chuck, wherein a thermal conductivity of the first layer in a stacking direction is higher than a thermal conductivity of the first layer in a plane direction, the stacking direction being a direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked, the plane direction being perpendicular to the stacking direction, wherein a thermal conductivity of the second layer in the plane direction is higher than a thermal conductivity of the second layer in the stacking direction, and wherein the second layer includes a resin;
- and a carbon sheet in the resin, the carbon sheet including main surfaces parallel to the plane direction, wherein the resin directly covers each of the main surfaces of the carbon sheet;
- wherein the second layer is thinner than the first layer.
Dependencies are inferred from the claim text.