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US 11,145,530 B2Granted
System and method for alignment of an integrated circuit
AssigneeCerebras Systems Inc.
InventorsJean-Philippe Fricker, Tim Botsford, Philip Ferolito, Paul Kennedy
Life of this patent
Estimating the term…
Abstract
The integrated circuit assembly can include: a semiconductor and a substrate (e.g., PCB). The integrated circuit assembly can optionally include: a compliant connector, a thermal management, and a securing element. The semiconductor 210 can include a first alignment feature. (e.g., orifice). The substrate can include a second alignment feature (e.g., alignment target) and conductive pads. The substrate can optionally include a cavity.
Claims21
A method comprising:
- aligning a front face of a printed circuit board (PCB) against a front face of a semiconductor, comprising:
- recording a first image comprising the front face of the PCB viewed through an orifice in the semiconductor;
- based on the first image, determining whether a contrast material, arranged on the front face of the PCB, is within a threshold offset from the orifice;
- and
- when the contrast material is within the threshold offset from the orifice, connecting the semiconductor to the PCB, comprising compressing a compliant connector between the semiconductor and the PCB by applying a compression force;
- before connecting the semiconductor to the PCB, covering the first orifice with an opaque layer at a first broad face;
- and
- validating alignment of the PCB and the semiconductor, comprising:
- recording a second image from a back face of the PCB;
- and
- based on the second image, determining that the contrast material is within the threshold offset of the orifice.
8 more elements
A system comprising:
- an integrated circuit comprising:
- a semiconductor defining a front face, a back face, and an orifice extending from the front face to the back face;
- a die formed on the front face;
- a first plurality of conductive pads arranged along the front face and electrically connected to the die;
- a printed circuit board (PCB) defining a front PCB face, a back PCB face, and a cavity extending from the back PCB face through a partial thickness of the PCB, the PCB comprising:
- a second plurality of conductive pads arranged along the front face;
- and
- a contrast material arranged along the front face, the contrast material aligned with the cavity and the orifice;
- and
- a compliant connector arranged between the front faces of the semiconductor and the PCB, the compliant connector electrically connecting each of the first plurality of conductive pads to a respective conductive pad of the second plurality,
- wherein the PCB is substantially opaque, and
- wherein a remaining thickness of the PCB between a base of the cavity and the front PCB face is translucent.
9 more elements
A system comprising:
- an integrated circuit comprising:
- a semiconductor defining a front face, a back face, and an orifice extending from the front face to the back face;
- a die formed on the front face;
- a first plurality of conductive pads arranged along the front face and electrically connected to the die;
- a printed circuit board (PCB) defining a front PCB face, a back PCB face, and a cavity extending from the back PCB face through a partial thickness of the PCB, the PCB comprising:
- a second plurality of conductive pads arranged along the front face;
- and
- a contrast material arranged along the front face, the contrast material aligned with the cavity and the orifice;
- and
- a compliant connector arranged between the front faces of the semiconductor and the PCB, the compliant connector electrically connecting each of the first plurality of conductive pads to a respective conductive pad of the second plurality;
- and
- a thermal management component arranged along the back face of the semiconductor, wherein the thermal management component is opaque, wherein the cavity, the thermal management component, and the compliant connector cooperatively enclose a volume of air.
9 more elements
Dependencies are inferred from the claim text.