Method of analyzing a manufacturing of a semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChih-Yu Wang
Life of this patent
Estimating the term…
Abstract
A method of monitoring or analyzing a manufacturing of a semiconductor structure includes providing a semiconductor structure; providing a camera disposed around the semiconductor structure; disposing a liquid substance over the semiconductor structure; removing a portion of the semiconductor structure; removing the liquid substance from the semiconductor structure; capturing a plurality of first images of the semiconductor structure by the camera; analyzing the plurality of first images; identifying a region of the semiconductor structure where a residue of the liquid substance is disposed based on the analysis of the plurality of first images; and performing a response based on the identification of the region of the semiconductor structure.
Claims20
A method, comprising:
- providing a semiconductor structure;
- providing a camera disposed around the semiconductor structure;
- disposing a liquid substance over the semiconductor structure;
- removing the liquid substance from the semiconductor structure;
- capturing a plurality of first images of the semiconductor structure by the camera;
- analyzing the plurality of first images;
- identifying a region of the semiconductor structure where a residue of the liquid substance is disposed based on the analysis of the plurality of first images;
- and
- removing the residue of the liquid substance from the semiconductor structure after the identification of the region of the semiconductor structure.
A method, comprising:
- providing a semiconductor structure;
- providing a camera disposed above the semiconductor structure;
- disposing a liquid substance over the semiconductor structure;
- removing the liquid substance from the semiconductor structure;
- capturing a plurality of images of the semiconductor structure by the camera;
- analyzing the plurality of images;
- identifying a residue of the liquid substance disposed over or within the semiconductor structure based on the analysis of the plurality of images;
- and
- adjusting at least one of parameters associated with the removal of the liquid substance from the semiconductor structure;
- and
- removing the residue from the semiconductor structure based on the identification of the residue and the adjustment of the at least one of parameters.
A method, comprising:
- providing a semiconductor structure;
- providing a camera disposed above the semiconductor structure;
- disposing a liquid substance over the semiconductor structure to form a coating on a surface of the semiconductor structure;
- capturing a plurality of first images of the coating by the camera;
- analyzing the plurality of first images;
- identifying a first excessive liquid substance disposed over the coating based on the analysis of the plurality of first images;
- performing a first removal of the first excessive liquid substance based on the identification of the first excessive liquid substance;
- capturing a plurality of second images of the coating by the camera;
- analyzing the plurality of second images;
- identifying a second excessive liquid substance disposed over the coating based on the analysis of the plurality of second images;
- and
- performing a second removal of the second excessive liquid substance based on the identification of the second excessive liquid substance.
Dependencies are inferred from the claim text.