Apparatus and method for treating substrate
AssigneeSemes Co., Ltd.
InventorSukhwan Chi
Life of this patent
Estimating the term…
Abstract
An apparatus for treating a substrate using a process gas includes a chamber having a treatment space defined therein, a substrate support unit for supporting the substrate in the treatment space, a gas supply pipe disposed in a ceiling surface of the chamber for supplying the process gas to the treatment space, and an exhaust unit for exhausting the process gas in the treatment space, wherein the exhaust unit includes an exhaust plate having an exhaust hole defined therein through which the process gas is exhausted, and an adjustment plate overlapping the exhaust plate, wherein the adjustment plate is constructed to control an opened amount of the exhaust hole when viewed from above.
Claims11
An apparatus for treating a substrate using a process gas, the apparatus comprising:
- a chamber having a treatment space defined therein;
- a substrate support unit for supporting the substrate in the treatment space;
- a gas supply pipe disposed in a ceiling surface of the chamber for supplying the process gas to the treatment space;
- and
- an exhaust unit for exhausting the process gas in the treatment space,
- wherein the exhaust unit includes:
- an exhaust plate having an exhaust hole defined therein through which the process gas is exhausted;
- and
- an adjustment plate overlapping the exhaust plate, wherein the adjustment plate is constructed to control an opened amount of the exhaust hole when viewed from above,
- wherein the exhaust plate and adjustment plate are disposed between the ceiling surface of the chamber and the substrate placed on the substrate support unit.
Dependencies are inferred from the claim text.