Manufacturing method of semiconductor device with attached film
AssigneeDenso Corporation
InventorsShuntaro Yamada, Akinori Kanda, Tetsuo Yoshioka, Takashige Nagao, Kouichi Miyashita
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Abstract
In a manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the film is attached on the rear surface, a rear surface side groove is provided by half-cutting the substrate from the rear surface together with the film, a protective member is attached to the film after the rear surface side groove is provided, and a front surface side groove connected to the rear surface side groove is provided by dicing the substrate from the front surface after the protective member is attached.
Claims9
A manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the manufacturing method comprising:
- attaching the film on the rear surface;
- providing a rear surface side groove by half-cutting the substrate from the rear surface together with the film;
- attaching a protective member to the film after the providing the rear surface side groove;
- and
- providing a front surface side groove connected to the rear surface side groove by dicing the substrate from the front surface after the attaching the protective member, wherein
- in the providing the rear surface side groove, the half-cutting the substrate is performed to cause an anti-fold strength of a portion of the substrate interposed between the rear surface side groove and the front surface to be higher than an anti-fold strength at which the substrate cracks when the front surface side groove is provided.
A manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the manufacturing method comprising:
- attaching the film on the rear surface;
- providing a rear surface side groove by half-cutting the substrate from the rear surface together with the film;
- attaching a protective member to the film after the providing the rear surface side groove;
- and
- providing a front surface side groove connected to the rear surface side groove by dicing the substrate from the front surface after the attaching the protective member, wherein
- the providing the front surface side groove includes providing a first front surface side groove, and then providing a second front surface side groove having a width smaller than a width of the first front surface side groove in a bottom of the first front surface side groove to cause the front surface side groove to have a stepped shape whose width decreases toward the rear surface.
Dependencies are inferred from the claim text.