Back to results
US 11,145,384 B2Granted
Memory devices and methods for managing error regions
AssigneeMicron Technology, Inc.
InventorJoe M. Jeddeloh
Life of this patent
Estimating the term…
Abstract
Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
Claims22
A memory device, comprising:
- a logic die configured to communicate with an external host through multiple serial link interfaces, the logic die including memory control circuitry;
- multiple interconnected memory die stacked with the logic die, wherein the multiple memory die each contain multiple tiles of memory, and wherein the multiple memory die are partitioned at a first time into multiple memory vaults, wherein the multiple memory vaults each include tiles from two or more stacked memory die;
- the logic die configured to, at a second time, repartition one or more of the memory vaults.
A memory device, comprising:
- a logic structure coupled to a stack of DRAM memory die, wherein each DRAM die of the stack of DRAM memory die is interconnected with at least one other DRAM die of the stack of DRAM memory die by through wafer interconnects, wherein the DRAM die each include multiple tiles;
- the stack of DRAM memory die allocated according to a first partition state establishing multiple first partitions established according to one or more first memory maps, each partition including one or more tiles from each of two or more DRAM die of the stack of DRAM memory die;
- wherein the logic structure comprises multiple serial interfaces configured for communication with a host system;
- and
- wherein the logic structure is configured to monitor portions of the stack of DRAM memory die to collect error data indicating defective portions within one or more of the partitions, and to repartition the stack of DRAM memory die to a second partition state according to one or more second memory maps in the logic die to remove a defective portion from one or more of the multiple first partitions.
2 more elements
Dependencies are inferred from the claim text.