Memory with adjustable TSV delay

A system, comprising:

• a host device;
• a memory device operably connected to the host device, wherein the memory device includes a plurality of memory dies and a through-silicon via (TSV) configured to transmit signals between at least two of the plurality of memory dies, or between two or more memory dies of the plurality of memory dies and the host device, or between any combination thereof;
• first circuitry included on one memory die of the plurality of memory dies and coupled to the TSV such that the first circuitry is configured to introduce propagation delay onto signals transmitted to or received from the TSV at only the one memory die;
• and
• second circuitry configured to activate, deactivate, or adjust the first circuitry to alter the propagation delay based at least in part on internal timings of the signals transmitted to or received from the TSV at another memory die of the plurality of memory dies.