Display device and method for manufacturing same

A display device comprising:

• a substrate including, a base layer including an active area and a peripheral area disposed adjacent to the active area, an encapsulation substrate covering the substrate, and a sealing unit disposed between the substrate and the encapsulation substrate and overlapping the peripheral area;
• an input sensing layer disposed on the encapsulation substrate and including a first conductive layer and a second conductive layer spaced apart from each other with a sensing insulation layer interposed therebetween;
• and
• a static electricity blocking unit disposed on the encapsulation substrate and overlapping the peripheral area, wherein the static electricity blocking unit includes a first blocking pattern and a second blocking pattern each having, a first resistance and the first blocking pattern and the second blocking pattern are spaced apart from each other by a space, and a connection pattern having a second resistance connected to the first blocking pattern at one end and the second blocking pattern at another end, the connection pattern including a plurality of segments, that are spaced apart from each other, disposed above the first and second blocking pattern, each of the plurality of segments connecting the first blocking pattern and the second blocking pattern to each other across the scaling unit,
• wherein the second resistance is greater than the first resistance, and
• wherein a width of the sealing unit is less than a width of the space between the first blocking pattern and the second blocking pattern.

A method for manufacturing a display device, the method comprising:

• providing a display panel including a substrate having a plurality of pixels and divided into an active area on which the pixels are formed and a peripheral area adjacent to the active area, an encapsulation substrate at least partially covering the substrate, and a preliminary sealing unit disposed between the substrate and the encapsulation substrate in the peripheral area;
• forming a first preliminary conductive layer on the encapsulation substrate;
• forming a first conductive layer by patterning a portion of the first preliminary conductive layer overlapping the active area;
• forming a plurality of blocking patterns spaced apart from each other by a predetermined space by patterning a portion of the first preliminary conductive layer overlapping the peripheral area;
• forming a second preliminary conductive layer on the first conductive layer;
• forming a second conductive layer by patterning a portion of the preliminary second conductive layer overlapping the active area;
• forming a connection pattern which connects the blocking patterns by patterning a portion of the preliminary second conductive layer overlapping the peripheral area, the connection pattern including a plurality of segments, that are spaced apart from each other, disposed above the plurality of blocking pattern, each of the plurality of segments connecting a first blocking pattern, of the plurality of blocking patterns, and a second blocking pattern, of the plurality of blocking patterns, to each other across a preliminary sealing unit;
• and
• forming a sealing unit by irradiating the preliminary sealing unit with a laser,
• wherein the sealing unit is firmed by irradiating the preliminary sealing unit with the laser through the predetermined space to cure the preliminary sealing unit, and
• wherein a width of the sealing unit is less than a width of the predetermined space between the plurality of blocking patterns.