Descriptor guided fast marching method for analyzing images and systems using the same
AssigneeMicron Technology, Inc.
InventorsYuan He, Hong Chen
Life of this patent
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Abstract
Methods and systems for descriptor guided fast marching method based image analysis and associated systems are disclosed. A representative image processing method includes processing an image of a microelectronic device using a fast marching algorithm to obtain arrival time information for the image. The arrival time information is analyzed using a targeted feature descriptor to identify targeted features. The detection of defects is facilitated by segmenting the image. The segmented image can be analyzed to identify targeted features which are then labeled for inspection.
Claims16
A method for identifying defects of a microelectronic device, the method comprising:
- processing a first image of the microelectronic device using a fast marching method to produce a second, processed image representative of the first image of the microelectronic device;
- determining one or more potential defects in the second image using at least one defect descriptor for segmenting the second image;
- identifying device features in the first image of the microelectronic device;
- identifying potential defects, if any, in the first image of the microelectronic device based on the determination of the one or more potential defects in the second image, the potential defects having associated device features;
- and
- applying first labels to respective identified device features in the first image and second labels to respective identified potential defects in the first image, the respective identified device features and the respective identified potential defects being spaced apart from their first and second labels, wherein each of the second labels is within an associated one of the first labels.
A method for identifying defects of a microelectronic device, the method comprising:
- processing an image of the microelectronic device using a fast marching method to produce an arrival time image;
- determining one or more potential defects in the arrival time image using at least one defect descriptor configured to segment the arrival time image independent of locations of defects in the arrival time image;
- identifying one or more device features and potential defects of the one or more device features, if any, in the image of the microelectronic device, wherein the identification of the potential defects is based on the determination of the one or more potential defects in the arrival time image;
- and
- labelling the identified one or more device features and the identified potential defects in in the image of the microelectronic device, wherein the labelled image of the microelectronic device includes labels indicating the identified potential defects for visual inspection of the identified potential defects, wherein the one or more device features and the potential defects are unobstructed by their corresponding labels, wherein each of the labels that indicate the identified potential defects are within one of the labels that indicate the corresponding one or more device features.
A method for identifying defects of a microelectronic device, the method comprising:
- processing a first image of the microelectronic device using a fast marching method to produce a second, processed image representative of the first image of the microelectronic device;
- segmenting the second image using at least one defect descriptor;
- identifying one or more potential defects in the segmented second image;
- identifying device features in the first image of the microelectronic device, each of the one or more potential defects having an associated identified device feature;
- and
- generating a defect-labelled first image of the microelectronic device by applying first labels that enclose and are spaced apart from the identified one or more potential defects in the first image of the microelectronic device to avoid obscuring the identified one or more potential defects and applying second labels that enclose the associated identified device features and the first labels of an associated one or more potential defect.
Dependencies are inferred from the claim text.