Methods and systems for wafer image generation

Abstract

A method is disclosed of generating a die tensor of a wafer from a Computer-Aided Design (CAD) file. According to the method, a segmentation engine segments a wireframe image obtained from the CAD file into a plurality of entities. An image transformation engine performs a transform on each of the plurality of entities based on at least one of the wireframe image, metrology, a design specification, process information, and optical information. The transform is performed iteratively based on the optical information. A stitch engine generates a die tensor, having a predefined number of slices, by combining each of the transformed plurality of entities.

Dependencies are inferred from the claim text.