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US 11,144,701 B2Granted
System and method for key parameter identification, process model calibration and variability analysis in a virtual semiconductor device fabrication environment
AssigneeCoventor, Inc.
InventorsWilliam J. Egan, Kenneth B. Greiner, David M. Fried, Anshuman Kunwar
Life of this patent
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Abstract
A virtual fabrication environment for semiconductor device fabrication that includes an analytics module for performing key parameter identification, process model calibration and variability analysis is discussed.
Claims27
A non-transitory computer-readable medium holding computer-executable instructions for key parameter identification in a virtual semiconductor fabrication environment, the instructions when executed causing at least one computing device to:
- receive, for a semiconductor device structure to be virtually fabricated in a computing device-generated virtual fabrication environment, a selection of 2D design data and a process sequence that includes a plurality of processes;
- perform with the computing device a plurality of virtual fabrication runs for the semiconductor device structure based on a Design of Experiment (DOE) using the 2D design data and the process sequence, the plurality of virtual fabrication runs building a plurality of 3D models;
- receive a user identification of one or more targets for the semiconductor device structure;
- execute an analytics module in the virtual fabrication environment to identify one or more outliers in measurement data for the one or more targets in the plurality of 3D models produced from the virtual fabrication runs;
- receive a user selection to include or remove one or more of the one or more identified outliers from the measurement data for the one or more targets in the plurality of 3D models, the selection received via a user interface provided in the virtual fabrication environment, the outliers including one or more repeated values and/or one or more data values exceeding a threshold based on the measurement data;
- perform a linear or quadratic regression analysis on the measurement data for the one or more targets with the analytics module after the including or removing of the selected outliers from the measurement data;
- identify one or more key parameters with the analytics module based on a result of the regression analysis, the key parameters being parameters whose value affects the measurement data for the one or more targets;
- and
- display or export an identification of the identified one or more key parameters.
6 more elements
A method for key parameter identification in a virtual semiconductor fabrication environment, comprising:
- receiving, for a semiconductor device structure to be virtually fabricated in a computing device-generated virtual fabrication environment, a selection of 2D design data and a process sequence that includes a plurality of processes;
- performing with the computing device a plurality of virtual fabrication runs for the semiconductor device structure based on a Design of Experiment (DOE) using the 2D design data and the process sequence, the plurality of virtual fabrication runs building a plurality of 3D models;
- receiving a user identification of one or more targets for the semiconductor device structure;
- executing an analytics module in the virtual fabrication environment to identify one or more outliers in measurement data for the one or more targets in the plurality of 3D models produced from the virtual fabrication runs;
- receiving a user selection to include or remove one or more of the one or more identified outliers from the measurement data for the one or more targets in the plurality of 3D models, the selection received via a user interface provided in the virtual fabrication environment, the outliers including one or more repeated values and/or one or more data values exceeding a threshold based on the measurement data;
- performing a linear or quadratic regression analysis on the measurement data for the one or more targets with the analytics module after the including or removing of the selected outliers from the measurement data;
- identifying one or more key parameters with the analytics module based on a result of the regression analysis, the key parameters being parameters whose value affects the measurement data for the one or more targets;
- and
- displaying or exporting an identification of the identified one or more key parameters.
6 more elements
A virtual fabrication system, comprising:
- a computing device equipped with a processor and configured to generate a virtual fabrication environment that includes an analytics module, the virtual fabrication environment:
- receiving, for a semiconductor device structure to be virtually fabricated, a selection of 2D design data and a process sequence that includes a plurality of processes,
- performing a plurality of virtual fabrication runs for the semiconductor device structure based on a Design of Experiment (DOE) using the 2D design data and the process sequence, the plurality of virtual fabrication runs building a plurality of 3D models,
- receiving a user identification of one or more targets for the semiconductor device structure,
- executing the analytics module in the virtual fabrication environment to identify one or more outliers in measurement data for the one or more targets in the plurality of 3D models produced from the virtual fabrication runs,
- receiving a user selection to include or remove one or more of the one or more identified outliers from the measurement data for the one or more targets in the plurality of 3D models, the selection received via a user interface provided in the virtual fabrication environment, the outliers including one or more repeated values and/or one or more data values exceeding a threshold based on the measurement data,
- performing a linear or quadratic regression analysis on the measurement data for the one or more targets with the analytics module after the including or removing of the selected outliers from the measurement data,
- identifying one or more key parameters with the analytics module based on a result of the regression analysis the key parameters being parameters whose value affects the measurement data for the one or more target, and
- displaying or exporting an identification of the identified one or more key parameters;
- and
- a display surface in communication with the computing device, the display surface configured to display the 3D structural model in a 3D view.
8 more elements
Dependencies are inferred from the claim text.