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US 11,144,695 B2Granted
Wafer characteristic prediction method and electronic device
AssigneeDigWise Technology Corporation, LTD
InventorsJingJie Wu, Yuan-Hung Liao, Chih-Chen Liu
Life of this patent
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Abstract
A wafer characteristic prediction method and an electronic device are provided. The method includes: receiving a process parameter of a wafer during a mass production; inputting the process parameter to a prediction model to obtain a wafer characteristic of the wafer being mass produced; and outputting the wafer characteristic.
Claims16
A wafer characteristic predication method for an electronic device, the electronic device comprising an input circuit, a processor and an output circuit, the method comprising:
- receiving a process parameter of a wafer during a mass production by the input circuit;
- inputting the process parameter to a prediction model to obtain a wafer characteristic of the wafer being mass produced by the processor;
- and
- outputting the wafer characteristic by the output circuit.
1 more element
An electronic device, comprising:
- an input circuit;
- an output circuit;
- and
- a processor, each of the input circuit and the output circuit being coupled to the processor, wherein
- the input circuit receives a process parameter of a wafer during a mass production,
- the processor inputs the process parameter to a prediction model to obtain a wafer characteristic of the wafer being mass produced, and
- the output circuit outputs the wafer characteristic.
4 more elements
Dependencies are inferred from the claim text.