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US 11,144,101 B2Granted
Electronic device
AssigneeHuawei Technologies Co., Ltd.
InventorsLinfang Jin, Xiaowei Hui, Xiangyang Yang, Shaoxin Zhou
Life of this patent
Estimating the term…
Abstract
An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
Claims18
A mobile phone, comprising:
- a circuit board;
- a heat emitting element disposed on a first side of the circuit board, wherein the heat emitting element comprises a first heating element and a second heating element, and wherein the first heating element or the second heating element is a central processing unit (CPU);
- and
- a heat pipe group comprising:
- a first heat pipe positioned on the first heating element such that the first heat pipe is separated from the circuit board by the first heating element, wherein the first heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, and wherein the first heat pipe operates in a first working area when a first power consumption of the first heating element is in a first power consumption state;
- and
- a second heat pipe positioned on the second heating element such that the second heat pipe is separated from the circuit board by the second heating element, wherein the second heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, wherein the second heat pipe operates in a second working area when a second power consumption of the second heating element is in a second power consumption state, wherein the first power consumption is different from the second power consumption, wherein the first working area corresponding to the first heat pipe is different from the second working area corresponding to the second heat pipe, wherein a thermal resistance range of the first heat pipe and the second heat pipe is 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe works in the first working area and the second heat pipe works in the second working area, wherein the first power consumption is greater than the second power consumption, and wherein the first heat pipe has a lower thermal resistance when the first power consumption of the first heating element is at the first power consumption state than when the second power consumption of the second heating element is at the second power consumption state.
4 more elements
An electronic device, comprising:
- a circuit board;
- a heat emitting element disposed on a first side of the circuit board, wherein the heat emitting element comprises a first heating element and a second heating element, and wherein the first heating element or the second heating element is a central processing unit (CPU);
- and
- a heat pipe group comprising:
- a first heat pipe positioned on the first heating element such that the first heat pipe is separated from the circuit board by the first heating element, wherein the first heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, and wherein the first heat pipe operates in a first working area when a first power consumption of the first heating element is in a first power consumption state;
- and
- a second heat pipe positioned on the second heating element such that the second heat pipe is separated from the circuit board by the second heating element, wherein the second heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, wherein the second heat pipe operates in a second working area when a second power consumption of the second heating element is in a second power consumption state, wherein the first power consumption is different from the second power consumption, wherein the first working area corresponding to the first heat pipe is different from the second working area corresponding to the second heat pipe, wherein a thermal resistance range of the first heat pipe and the second heat pipe is 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe works in the first working area and the second heat pipe works in the second working area, wherein the first power consumption is greater than the second power consumption, and wherein the first heat pipe has a lower thermal resistance when the first power consumption of the first heating element is at the first power consumption state than when the second power consumption of the second heating element is at the second power consumption state.
4 more elements
Dependencies are inferred from the claim text.