Cleaning method and cleaning system for reticle pod

A method of cleaning a reticle pod, the method comprising:

• receiving a dual reticle pod that includes an inner pod and an outer pod;
• disassembling the dual reticle pod to extract the inner pod;
• inspecting a surface of a base plate of the inner pod to detect defects;
• performing a local plasma cleaning process at a defect location on the surface of the base plate using an atmospheric pressure plasma injector;
• performing wet cleaning processes on the inner pod and the outer pod respectively, performing the wet cleaning process on the outer pod being performed in parallel with and at the same time the inspecting and wet cleaning of the inner pod is performed;
• and
• reassembling the dual reticle pod to attach the inner pod and the outer pod.

An exposure method, comprising:

• receiving a dual reticle pod;
• cleaning the dual reticle pod;
• accommodating a reticle within the cleaned dual reticle pod;
• transferring the dual reticle pod containing the reticle to exposure equipment;
• and
• performing an exposure process on a wafer using the reticle;
• wherein cleaning the dual reticle pod includes:
• disassembling the dual reticle pod to extract an inner pod and an outer pod;
• detecting defects by inspecting a surface of a base plate of the inner pod;
• performing a local plasma cleaning process at a defect location on the surface of the base plate using an atmospheric pressure plasma injector;
• performing a wet cleaning process on the inner pod;
• and
• performing a wet cleaning process on the outer pod in parallel with and at the same time the detecting defects and wet cleaning of the inner pod is performed.