LED wafer, LED wafer detection device, and LED wafer detection method

An LED wafer, comprising:

• a wafer base;
• a plurality of LED chips disposed on the wafer base;
• a plurality of positive test circuit layers disposed on the wafer base;
• a plurality negative test circuit layers disposed on the wafer base;
• a plurality of positive test contacts disposed on the wafer base;
• and
• a plurality of negative test contacts disposed on the wafer base;
• wherein each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer;
• wherein the positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers;
• wherein when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source;
• wherein the LED chips, the positive test circuit layers and the negative test circuit layers respectively form a plurality of orthographic chip projections, a plurality of orthographic positive test circuit layer projections and a plurality of orthographic negative test circuit layer projections on the wafer base, the orthographic chip projections are disposed away from the orthographic positive test circuit layer projections and the orthographic negative test circuit layer projections.

An LED wafer detection method, comprising:

• providing an LED wafer including a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts and a plurality of negative test contacts, wherein the LED chips, the positive test circuit layers and the negative test circuit layers respectively form a plurality of orthographic chip projections, a plurality of orthographic positive test circuit layer projections and a plurality of orthographic negative test circuit layer projections on the wafer base, the orthographic chip projections are disposed away from the orthographic positive test circuit layer projections and the orthographic negative test circuit layer projections;
• inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts so as to excite each LED chip to generate a light source;
• and
• using a light-detecting module to optically detect the light source that is generated by each LED chip.