Method and system for data collection and analysis for semiconductor manufacturing

A method comprising:

• receiving, from a system manufacturer, system test data for a plurality of electronic systems, each of the plurality of electronic systems comprising a plurality of electronic components;
• determining a relationship between a set of electronic components from the plurality of electronic components and the electronic systems upon which the electronic components of the set of electronic components are assembled;
• receiving, from a component manufacturer, manufacturing attributes including spatial data for the set of electronic components;
• selecting a first data subset from the system test data corresponding to a first subgroup of the set of electronic components, wherein the first subgroup comprises electronic components within a first area defined on a substrate according to a spatial pattern and that is fewer than all of the set of electronic components on the substrate;
• selecting a second data subset from the system test data corresponding to a second subgroup of the set of electronic components, wherein the second subgroup comprises electronic components within a second area defined on the substrate that differs from the first area;
• identifying the first data subset as an outlier relative to the second data subset;
• and
• communicating information about the outlier to at least one of the system manufacturer or the component manufacturer.