Insulator applied in a probe base and the probe base

A probe base, for testing a semiconductor component, comprising:

• a base body, with at least a testing zone provided for placing the semiconductor component;
• at least a composite assembly, installed in the testing zone, and having at least a probe hole for installing a probe;
• and
• at least an insulator, being a sheet structure installed in the probe hole, and having a probe mounting hole, a plurality of through holes, a first surface and a second surface, and the probe mounting hole being disposed at a center of the insulator, and the first surface and the second surface are configured to be opposite to each other, and the probe mounting hole and the through holes penetrating through the first surface to the second surface, and the regions of the first surface and the second surface without the probe mounting hole or the through holes being coplanar;
• wherein the composite assembly comprises at least a metal module and at least a non-metal module, and the metal module and the non-metal module are assembled in a partial overlapped status;
• wherein the metal module has a first installing portion, and the non-metal module has a second installing portion, and the first installing portion and the second installing portion are corresponding concave and convex structures respectively, and the first installing portion and the second installing portion are engaged with each other during assembling.