Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsJin-Wei You, Cheng-Kai Chang
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Abstract
The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.
Claims14
An electronic packaging structure, comprising:
- an electronic device;
- an electronic package disposed on the electronic device;
- a photonic die disposed on and electrically connected to the electronic package;
- and
- an optical guide die snapped on and electrically connected to the electronic device, wherein the optical guide die is communicatively connected to the electronic package and free from being disposed on the electronic package and the photonic die.
An electronic packaging structure, comprising:
- an electronic device;
- an electronic package disposed on the electronic device;
- a photonic die disposed on and electrically connected to the electronic package;
- and
- an optical guide die communicatively connected to the electronic package and free from being disposed on the electronic package and the photonic die, wherein the optical guide die is free from being disposed on the electronic device.
A method for manufacturing an electronic packaging structure, comprising:
- providing an electronic package;
- disposing the electronic package on an electronic device;
- disposing a photonic die on the electronic package and electrically connecting the photonic die to the electronic package;
- and
- communicatively connecting an optical guide die to the electronic package with the optical guide die free from being disposed on the electronic package and the photonic die, wherein the optical guide die is snapped on and electrically connected to the electronic device.
A method for manufacturing an electronic packaging structure, comprising:
- providing an electronic package;
- disposing the electronic package on an electronic device;
- disposing a photonic die on the electronic package and electrically connecting the photonic die to the electronic and
- communicatively connecting an optical guide die to the electronic package with the optical guide die free from being disposed on the electronic package and the photonic die, wherein the optical guide die is free from being disposed on the electronic device.
Dependencies are inferred from the claim text.