Substrate processing apparatus, substrate processing method, and storage medium
AssigneeTokyo Electron Limited
InventorShinichiro Misaka
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.
Claims8
A substrate processing apparatus comprising:
- a heating chamber including a heat plate having a plurality of heating control regions that are radially arranged around a center of the heat plate to heat a substrate placed on the heat plate, the plurality of heating control regions being independently controlled in temperature;
- a detecting chamber including a holder configured to rotate the substrate and a distance sensor configured to measure a first distance to the substrate from a plane orthogonal to a center axis of the substrate at an outer periphery of the substrate;
- and
- a controller configured to control an overall operation of the substrate processing apparatus,
- wherein the controller is configured to:
- detect a deformation result of the substrate based on the first distance measured by the distance sensor and a second distance measured along the outer periphery of the substrate by rotating the substrate with the holder,
- adjust a rotational orientation of the substrate such that a position on the substrate where a deformation amount is maximum is not placed on a boundary between the plurality of heating control regions based on the detected deformation result of the substrate, or perform a selective activation of the plurality of heating control regions based on the detected deformation result of the substrate, and
- heat the substrate in a state where the rotational orientation of the substrate is adjusted.
A substrate processing method comprising:
- detecting a deformation result of a substrate based on a first distance to the substrate measured by a distance sensor from a plane orthogonal to a center axis of the substrate and a second distance measured along an outer periphery of the substrate while rotating the substrate with a holder;
- adjusting a rotational orientation of the substrate such that a position on the substrate where a deformation amount is maximum is not placed on a boundary between a plurality of heating control regions that are radially arranged around a center of a heat plate, based on the deformation result obtained in the detecting, the plurality of heating control regions being independently controlled in temperature, or performing a selective activation of the plurality of heating control regions based on the deformation result obtained in the detecting;
- and
- heat the substrate in a state where the rotational orientation of the substrate is adjusted.
A substrate processing apparatus comprising:
- a heat plate having a plurality of heating control regions that are radially arranged around a center of the heat plate to heat a substrate placed on the heat plate, the plurality of heating control regions being independently controlled in temperature;
- and
- a controller configured to:
- adjust a rotational orientation of the substrate such that a position on the substrate where a deformation amount is maximum is not placed on a boundary between the plurality of heating control regions based on a deformation result of the substrate, and
- heat the substrate in a state where the rotational orientation of the substrate is adjusted,
- wherein the controller detects the deformation result of the substrate based on a first distance measured to the substrate from a plane orthogonal to a center axis of the substrate and a second distance measured along an outer periphery of the substrate by rotating the substrate.
Dependencies are inferred from the claim text.