Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof
AssigneeTesa SE
InventorsKlaus Keite-Telgenbüscher, Christian Schuh, Bernd Lühmann, Thilo Dollase, Minyoung Bai, Thorsten Krawinkel
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Abstract
Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
Claims20
A method for encapsulating an (opto)electronic arrangement comprising encapsulating a (opto)electronic arrangement with a pressure-sensitive adhesive, a single-sided adhesive tape, or double-sided adhesive tape, wherein:
- the pressure sensitive adhesive comprises at least two constituents from which an interpenetrating network having at least two phases is formed by a crosslinking buildup reaction;
- the first phase formed after the buildup reaction is based on vinylaromatic block copolymers and has at least a differential scanning calorimetry (DSC) softening temperature of less than 23° C.;
- the second phase formed after the buildup reaction has a DSC softening temperature of greater than 23° C.;
- the second phase formed after the buildup reaction has the morphology of a connected nanoparticle network;
- the mass ratio of the first phase formed after the buildup reaction to the second phase formed after the buildup reaction is between 85:15 and 50:50;
- and
- the single sided adhesive tape or the double sided adhesive tape is formed with the pressure-sensitive adhesive.
Dependencies are inferred from the claim text.