Adhesive and method of encapsulating organic electronic device using the same

An adhesive for encapsulating an organic electronic device (OED), comprising:

• a curable resin, and
• a moisture absorbent,
• wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED);
• and a second region not coming in contact with the organic electronic device (OED),
• wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive,
• wherein the adhesive has a viscosity at room temperature of 106 dyne·s/cm2 or more, and
• wherein the first region has a smaller thickness than the second region.

An adhesive for encapsulating an organic electronic device (OED), comprising:

• a curable resin, a high molecular weight resin and
• a moisture absorbent,
• wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED);
• and a second region not coming in contact with the organic electronic device (OED),
• wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.