Photosensitive resin composition, etching method and plating method

A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein

• the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) an acrylate monomer having a double bond equivalent of not more than 150;
• the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass % and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C);
• and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and
• wherein the photosensitive resin composition further comprises (E) a benzophenone-based sensitizer, the content of the benzophenone-based sensitizer being 0.20 to 0.40 mass % based on the photosensitive resin composition.