Method of fabricating sandpaper for grinding industrial parts and sandpaper fabricated by the method

A grinding apparatus including a sandpaper comprising:

• a spindle onto which the sandpaper is wound, the spindle being configured to be inserted into and rotated by an electric tool;
• a tape which fastens a lateral side portion of the sandpaper by winding the tape on the lateral side portion of the sandpaper to prevent a sandpaper roll which comprises the sandpaper wound onto the spindle from being unwound;
• and
• a bond which is installed on a lateral side of the sandpaper roll and in contact with a lateral side of the tape, and fastens the lateral side of the sandpaper roll by bonding, the sandpaper comprising a plurality of cutoff holes wherein the plurality of cutoff holes are formed on the sandpaper along a boundary line between an opposite lateral side of the tape and the sandpaper such that the plurality of cutoff holes are arranged circumferentially at equal intervals, the plurality of cutoff holes being separation holes along which a worn-out portion of the sandpaper is cut in a circumferential direction, and the sandpaper being configured to be cut longitudinally and uniformly by setting a single cutoff hole from the cutoff holes as a cutoff reference point,
• whereby the worn-out portion of the sandpaper is precisely and easily cut along the cutoff holes and then separated from the sandpaper roll.