Wire automatic soldering system

A wire automatic soldering system, comprising:

• a carrier adapted to load an electrical product to be soldered;
• a robot adapted to grip and move the carrier on which the electrical product is loaded;
• a solder paste container containing a solder paste, the robot adapted to insert a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste;
• a solder paste syringe configured to inject the solder paste into the solder paste container;
• a first moving mechanism adapted to move the solder paste syringe to an injection position for delivering solder paste into the solder paste container;
• and
• a second moving mechanism adapted to move the solder paste container to an injection station wherein the solder paste container is aligned with the solder paste syringe.

A wire automatic soldering system, comprising:

• an electrical product having two wires to be soldered extending therefrom;
• a carrier holding the electrical product and fixing a first portion of the two wires in a side by side position on the carrier, a second portion of the two wires to be soldered extending beyond the carrier;
• a vision detection system configured to:
• detect whether an actual soldering length of a soldered part of the wires is equal to or larger than a first predetermined length;
• and
• detect whether an actual soldering quality of the soldered part of the wires conforms to a predetermined soldering quality;
• a solder paste container containing a solder paste;
• a robot configured to:
• grip and move the carrier on which the electrical product is loaded;
• insert the two wires of the electrical product into the solder paste container to solder the wires together with the solder paste;
• if the actual soldering length is less than the first predetermined length, move the wires into the solder paste container, further soldering the wires until the actual soldering length is equal to or larger than the first predetermined length;
• and
• if the actual soldering quality does not conform to the predetermined soldering quality, move the wires into the solder paste container, further soldering the wires until the actual soldering quality conforms to the predetermined soldering quality;
• and
• a cutting mechanism configured to cut off a segment of the soldered part of the two wires so that a length of the soldered part is equal to a second predetermined length that is less than the first predetermined length, wherein the vision detection system is further configured to detect whether the length of the soldered part of the wires after the segment of the soldered part is cut off is larger than the second predetermined length, wherein, if the length of the soldered part after the segment of the soldered part is cut off is larger than the second predetermined length, the robot is further configured to move the wires to the cutting mechanism for cutting the soldered part until the length of the soldered part is equal to the second predetermined length.