Film forming method, storage medium, and film forming system
AssigneeTokyo Electron Limited
InventorsKentaro Yoshihara, Yuichi Yoshida, Naoki Shibata, Kousuke Yoshihara
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Abstract
A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.
Claims5
A film forming method for forming a resist film by applying a resist solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, the film forming method comprising:
- providing a substrate having projections and recesses;
- applying the resist solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the resist film, wherein the projections and recesses of the thick film are arranged to correspond to the projections and recesses on the surface of the substrate before formation of the thick film, wherein a depth of projections and recesses on the surface of the thick film is smaller than the depth of projections and recesses on the surface of the substrate to be formed with the resist film;
- and subsequently
- after modifying the surface of the thick film into a state of being soluble, removing the soluble surface of the thick film to form the resist film having the target film thickness.
Dependencies are inferred from the claim text.