Photosensitive resin composition and photosensitive resin printing plate precursor containing the same

Abstract

A photosensitive resin composition and a photosensitive resin printing plate precursor which allow development that uses a solution containing a lower alcohol and which are excellent in abrasion resistance and excellent in the ink wiping characteristics of a plate surface exhibited when the plate surface is squeegeed with a blade of a pad printer are provided. The photosensitive resin composition is characterized by containing (A) an inorganic fine particle whose average particle diameter is greater than or equal to 0.5 μm and less than or equal to 4 μm and whose sphericity is greater than or equal to 0.9, (B) a polyamide having in its molecular main chain an aliphatic ring and/or a skeleton represented by general formula (1), (C) a compound having an ethylenic double bond, and (D) a photopolymerization initiating agent.

Dependencies are inferred from the claim text.