Wafer-level homogeneous bonding optical structure and method to form the same
AssigneeHimax Technologies Limited
InventorsChih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan, Jen-Hui Lai
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Abstract
A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
Claims20
A wafer-level homogeneous bonding optical structure, comprising:
- an optically transparent wafer;
- at least two optical lens sets disposed on said optically transparent wafer, wherein each of said optical lens sets comprising a lens integrated with a residual layer;
- and
- at least one spacer disposed on said optically transparent wafer, wherein said spacer is disposed between two adjacent said optical lens sets, wherein said spacer and said optically transparent wafer are made of a silica material, and said spacers are homogeneously bonded to said optically transparent wafer in the absence of a heterogeneous adhesive with a bridge Si—O—Si bonding to result in a homogeneous bonding disposed on an interface of said spacer and said optically transparent wafer.
A method to form a wafer-level homogeneous bonding optical structure, comprising:
- providing an optically transparent wafer with at least two optical lens sets disposed on said optically transparent wafer, wherein each of said optical lens sets is isolated and comprises a lens integrated with a residual layer;
- providing at least one spacer in direct contact with said optically transparent wafer so that said spacer is disposed between two adjacent said optical lens sets to segregate two of adjacent said optical lens sets;
- and
- performing a laser treatment so that said spacer is homogeneously bonded to said optically transparent wafer in the absence of a heterogeneous adhesive.
A method to form a wafer-level homogeneous bonding optical structure, comprising:
- providing an optically transparent wafer with at least two optical lens sets disposed on said optically transparent wafer, wherein each of said optical lens sets is isolated and comprises a lens integrated with a residual layer;
- providing an optically transparent substrate with at least one spacer;
- combining said optically transparent substrate with said optically transparent wafer so that said optically transparent wafer is in direct with said spacers and said spacer is disposed between two adjacent said optical lens sets to segregate two of adjacent said optical lens sets;
- and
- performing a laser treatment so that said spacer is homogeneously bonded to said optically transparent wafer in the absence of a heterogeneous adhesive.
Dependencies are inferred from the claim text.