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US 11,137,296 B2Granted
Force sensor with MEMS-based device and force touching member
AssigneeMiramems Sensing Technology Co., Ltd
InventorsLi-Tien Tseng, Yu-Hao Chien, Chih-Liang Kuo, Yu-Te Yeh
Life of this patent
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Abstract
A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.
Claims8
A force sensor with a force touching member, comprising:
- a package substrate;
- a microelectromechanical system (MEMS)-based device disposed on the package substrate and electrically connected with the package substrate, wherein the MEMS-based device includes a MEMS element providing a deformable area;
- and
- a package body encapsulating the MEMS-based device,
- wherein the force touching member includes a rod for pressing disposed on the package body and the rod corresponds to a geometric center of the deformable area of the MEMS element of the MEMS-based device, and
- wherein the package body is filled between the rod and the deformable area.
3 more elements
Dependencies are inferred from the claim text.