Fluidic leakage handling for semiconductor apparatus

A lithography apparatus, comprising:

• a chuck configured to hold a substrate;
• a conduit configured to transport a coating material and a coolant;
• a disc disposed over the chuck, comprising:
• a first recess region surrounding the conduit, wherein the first recess region comprises a groove structure disposed at a top surface of the first recess region, and
• a first bulge region surrounding the first recess region;
• and
• an electric-type fluid leakage sensor surrounding the conduit and configured to detect the fluid leakage collected in the disc.

An apparatus, comprising:

• a chuck configured to hold a substrate;
• and
• a photoresist feeder disposed over the chuck, wherein the photoresist feeder comprises:
• a photoresist cartridge configured to dispense a coating material towards the chuck;
• a conduit fluidly connected to the photoresist cartridge and configured to fluidly transport a coolant;
• and
• a fluid leakage handling device including:
• a disc disposed above the chuck, comprising a recess region surrounding the conduit, wherein the recess region comprises a groove structure disposed at a top surface of the recess region, and
• an electric-type fluid sensor surrounding the conduit and configured to detect a fluid leakage from the conduit.