Apparatus and method for injection molding encapsulation

A method of encapsulating a substrate comprising:

• positioning the substrate on a support defined by a lower mold component within an injection mold;
• closing the mold by bringing an upper mold component into engagement with the lower mold component to form an encapsulation mold cavity around an edge of the substrate;
• applying a predetermined total pressure on a predetermined area of the substrate with a tiltable insert using a plurality of pressure-exerting actuators to seal the encapsulation mold cavity and prevent displacement of the substrate during injection, wherein the tiltable insert comprises a lower portion having a sealing surface defining a compensation space with a recess wall, said sealing surface having a height such that its top edge is displaced by a lateral distance equal to or less than the compensation space when the insert is tilted, and wherein the pressure-exerting actuators automatically and dynamically adjust the pressure on the substrate via the insert as a function of a thickness of the substrate thereby causing the tiltable insert to tilt slightly relative to the upper and lower mold components in response to local pressure resistance buildup as a result of an imperfection in the substrate until the predetermined total pressure is distributed substantially evenly across the predetermined area;
• injecting an encapsulation material into the encapsulation mold cavity;
• and releasing the substrate.