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US 11,126,083 B2Granted
Superstrate and a method of using the same
AssigneeCanon Kabushiki Kaisha
InventorsDouglas J. Resnick, Niyaz Khusnatdinov, Christopher Ellis Jones
Life of this patent
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AssigneeCanon Kabushiki Kaisha
InventorsDouglas J. Resnick, Niyaz Khusnatdinov, Christopher Ellis Jones
Estimating the term…
A superstrate can include a body having a surface; a buffer layer overlying the surface; and a protective layer overlying the buffer layer, wherein the protective layer has a surface roughness that is equal to or less than a surface roughness of the surface of the body. The protective layer can include a material that can be selectively removed with respect to the buffer layer, and the buffer layer can include a material that can be selectively removed with respect to the body of the superstrate. The superstrate can be used for more planarization or other processing sequences before the body needs to be replaced, as any defects that may form extend into the protective layer or buffer layer and not reach the body. The layers can be removed and replaced by corresponding new layers without significantly adversely affecting the body.
A superstrate comprising:
A superstrate comprising:
A superstrate for forming a planarization layer over a substrate, the superstrate comprising:
Dependencies are inferred from the claim text.