# US 11,122,719 B2 · Component mounter

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- Number: US 11,122,719 B2
- Document ID: US11122719B2
- Status: Granted
- Kind: B2
- Application number: 16/334,554
- Filed: 2016-09-21
- Published: 2020-03-12
- Granted: 2021-09-14
- Earliest claimed: 2016-09-21
- Assignees: Fuji Corporation
- Applicants: Fuji Corporation
- Inventors: Kohei Sugihara
- Web page: https://patentgrep.com/patent/US11122719B2

## CPC

- H05K 13/0406: {Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping}
- H05K 13/0408: {Incorporating a pick-up tool}
- H05K 13/0409: {Sucking devices}
- H05K 13/041: {having multiple pick-up tools}
- H05K 13/0413: {with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools}
- H05K 13/082: {Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A component mounter provided with a first raising and lowering device to raise and lower a raising and lowering member, and a second raising and lowering device to relatively raise a suction nozzle with respect to the raising and lowering member. The component mounter performs, among multiple types of operations of lowering the suction nozzle, a cleaning operation of cleaning the suction nozzle and a discarding operation of discarding a component for which an error occurred via a first operation mode of lowering the suction nozzle by driving the first raising and lowering device. Also, the component mounter performs pickup operation of picking up the component and mounting operation of mounting the component via a second operation mode of lowering the suction nozzle by driving the first raising and lowering device and the second raising and lowering device.

## Claims

### Claim 1

A component mounter for picking up a component supplied by a component supply device and mounting the component on a target object, the component mounter comprising:
a head provided on X-axis slider;
a holding member configured to hold a component, wherein the holding member is a nozzle;
a first raising and lowering device comprising a first vertically movable slider, configured to raise and lower a raising and lowering member with respect to the head; a second raising and lowering device comprising a second vertically movable slider, configured to relatively raise and lower the holding member with respect to the raising and lowering member and to be raised and lowered together with the raising and lowering member by the first raising and lowering device; and
a control device configured to selectively perform a first operation mode of driving the first raising and lowering device to lower the holding member, and a second operation mode of driving the first raising and lowering device and the second raising and lowering device to lower the holding member, and
perform a rejection operation of rejecting a component picked up by the holding member via the first operation mode in a case in which a type of the component is a non-specified type, and
perform the rejection operation of rejecting the component picked up by the holding member via the second operation mode in a case in which the type of the component is a specified type.

### Claim 2 (depends on 1)

The component mounter according to claim 1, further comprising a load measuring section provided on the second raising and lowering device and configured to measure a load applied with respect to the holding member using a sensor, wherein the control device is configured to perform an operation that does not require the load measuring section via the first operation mode, and perform an operation that requires the load measuring section via the second operation mode.

### Claim 3 (depends on 1)

The component mounter according to claim 1, wherein the control device is configured to perform a cleaning operation of cleaning the holding member using a cleaning tool via the first operation mode.

### Claim 4 (depends on 1)

The component mounter according to claim 1, wherein the control device is configured to perform a mounting operation of using the holding member to mount the component via the second operation mode.

### Claim 5 (depends on 1)

The component mounter according to claim 1, wherein the control device is configured to perform a pickup operation of using the holding member to pick up the component via the second operation mode.