# US 11,122,714 B2 · Power module having metallic heat-dissipation substrate

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- Number: US 11,122,714 B2
- Document ID: US11122714B2
- Status: Granted
- Kind: B2
- Application number: 16/589,874
- Filed: 2019-10-01
- Published: 2020-04-23
- Granted: 2021-09-14
- Earliest claimed: 2018-10-17
- Assignees: Delta Electronics, Inc.
- Applicants: Delta Electronics, Inc.
- Inventors: Da Jin; Shaojun Chen; Yahong Xiong
- Web page: https://patentgrep.com/patent/US11122714B2

## CPC

- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 3/368: {parallel to each other (H05K3/361 takes precedence)}
- H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 1/165: {incorporating printed inductors}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/1003: Non-printed inductor
- H05K 2201/10053: Switch
- H05K 2201/10318: Surface mounted metallic pins
- H05K 2201/10545: Related components mounted on both sides of the PCB
- H05K 2201/1056: Metal over component, i.e. metal plate over component mounted on or embedded in PCB
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)

## Abstract

A power module includes a power source module and a metallic bottom heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a top surface and a bottom surface. At least a heat-generating component is disposed on the bottom surface. The metallic bottom heat-dissipation substrate has an upper surface and a lower surface opposite to each other. The upper surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the bottom surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The lower surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

## Claims

### Claim 1

A power module comprising:
a power converter having an input pin and an output pin and comprising at least one heat-generating component and a printed circuit board, wherein the input pin and the output pin of the power converter are soldered on and electrically connected with a system board, the printed circuit board of the power converter has a first surface, a first penetration hole, and a second surface, and the at least one heat-generating component is disposed on the second surface of the printed circuit board; and
a metallic heat-dissipation substrate having a first surface and a second surface opposite to each other, and a second penetration hole, wherein the first surface of the metallic heat-dissipation substrate has at least one fixing position and at least one heat-dissipating position, the fixing position of the first surface of the metallic heat-dissipation substrate is connected with the second surface of the printed circuit board, a gap accumulated by tolerances is formed between the heat-dissipating position and the heat-generating component, a gap-filling material is filled into the gap, and the second surface of the metallic heat-dissipation substrate and the system board are soldered with each other,
wherein the first penetration hole and the second penetration hole are aligned to form a penetration hole set, wherein the penetration hole set is penetrated by a screw rod to fasten the printed circuit board and the metallic heat-dissipation substrate.

### Claim 2 (depends on 1)

The power module according to claim 1, wherein the power converter further comprises a magnetic component and at least one printed circuit board coil.

### Claim 3 (depends on 1)

The power module according to claim 1, wherein the heat-generating component of the power converter is a switch component, a transformer, or an inductance.

### Claim 4 (depends on 2)

The power module according to claim 2, wherein the fixing position of the first surface of the metallic heat-dissipation substrate is indirectly connected with the second surface of the printed circuit board of the power converter through a medium material.

### Claim 5 (depends on 2)

The power module according to claim 2, wherein the metallic heat-dissipation substrate has an opening, the magnetic component of the power converter is disposed in the opening of the metallic heat-dissipation substrate and one surface of the magnetic component is exposed at the opening.

### Claim 6 (depends on 1)

The power module according to claim 1, wherein the second surface of the printed circuit board of the power converter is soldered with the fixing position of the first surface of the metallic heat-dissipation substrate.

### Claim 7 (depends on 1)

The power module according to claim 1, wherein the thermal conductivity of the gap-filling material is greater than or equal to 0.3 Watts per meter-Kelvin (W/mK).

### Claim 8 (depends on 1)

The power module according to claim 1, wherein the second surface of the metallic heat-dissipation substrate is a flat surface.

### Claim 9 (depends on 1)

The power module according to claim 1, wherein the power module further comprises a plurality of pins disposed on the second surface, and the pins are inserted into the system board and soldered with the system board.

### Claim 10 (depends on 1)

The power module according to claim 1 further comprises a metallic top heat-dissipation substrate, wherein the metallic top heat-dissipation substrate is disposed on the first surface of the printed circuit board of the power converter, and the metallic top heat-dissipation substrate and the metallic bottom heat-dissipation substrate are commonly fixed with a same screw rod.

### Claim 11 (depends on 1)

The power module according to claim 1, wherein the input pin of the power converter and the output pin of the power converter are extended from the second surface of the printed circuit board.