# US 11,122,710 B2 · Heat dissipation structure for electronic device and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,710 B2 - Document ID: US11122710B2 - Status: Granted - Kind: B2 - Application number: 16/925,433 - Filed: 2020-07-10 - Published: 2020-10-29 - Granted: 2021-09-14 - Earliest claimed: 2016-09-28 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Linfang Jin; Guo Yang; Shuainan Lin - Web page: https://patentgrep.com/patent/US11122710B2 ## CPC - H05K 7/20518: {Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots} - H05K 7/20472: {Sheet interfaces} - H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame. ## Claims ### Claim 1 A device, comprising: a rear cover, wherein a heat dissipating layer is disposed on the rear cover; a middle frame; a first printed circuit board (PCB), wherein a first shield cover is disposed on a first surface of the first PCB, and a second shield cover is disposed on a second surface of the first PCB; a battery; and a speaker box; wherein the first PCB, the battery, and the speaker box are disposed between the rear cover and the middle frame, the first PCB is separated from the speaker box by the battery; wherein a first region of the heat dissipating layer corresponds to the first shield cover of the first PCB, the second shield cover of the first PCB is in contact with a first region of the middle frame; wherein a second region of the heat dissipating layer corresponds to the battery, and a surface of the battery that is distal to the heat dissipating layer is in contact with a second region of the middle frame; and wherein a third region of the heat dissipating layer corresponds to the speaker box. ### Claim 2 (depends on 1) The device according to claim 1, wherein the device further comprises a second printed circuit board (PCB), wherein the speaker box is disposed on a first surface of the second PCB, and a second surface of the second PCB that is distal to the speaker box is in contact with a third region of the middle frame. ### Claim 3 (depends on 2) The device according to claim 2, wherein the third region of the heat dissipating layer is adhered to a first surface of the speaker box by a heat conducting adhesive. ### Claim 4 (depends on 2) The device according to claim 2, wherein a charger is further disposed on the second PCB. ### Claim 5 (depends on 2) The device according to claim 2, wherein the heat dissipating layer comprises a heat equalizing layer, and wherein the heat equalizing layer is in contact with the first PCB, the battery, and the second PCB. ### Claim 6 (depends on 5) The device according to claim 5, wherein a coefficient of thermal conductivity of the heat equalizing layer is greater than or equal to 250 W/(m*K). ### Claim 7 (depends on 5) The device according to claim 5, wherein the heat dissipating layer further comprises a heat accumulating layer and a heat insulation layer, wherein the heat insulation layer is in contact with the rear cover, and wherein the heat accumulating layer is between the heat insulation layer and the heat equalizing layer. ### Claim 8 (depends on 7) The device according to claim 7, wherein a specific heat capacity of the heat accumulating layer is greater than or equal to 100 J/(g*K), and wherein a coefficient of thermal conductivity of the heat insulation layer is less than or equal to 0.5 W/(m*K). ### Claim 9 (depends on 2) The device according to claim 2, wherein the middle frame comprises a first separating piece and a second separating piece, wherein the first separating piece separates the first PCB from the battery along a longitudinal direction, wherein the second separating piece separates the battery from the second PCB along the longitudinal direction, and wherein the longitudinal direction is a direction perpendicular to a major surface of the heat dissipating layer. ### Claim 10 (depends on 9) The device according to claim 9, wherein a thermally conductive foam is between the second PCB and the second separating piece. ### Claim 11 (depends on 2) The device according to claim 2, wherein an antenna is further disposed on the second PCB. ### Claim 12 (depends on 1) The device according to claim 1, wherein the third region of the heat dissipating layer welded to a first surface of the speaker box. ### Claim 13 (depends on 1) The device according to claim 1, wherein a material of the speaker box is a thermally conductive material, and the thermally conductive material comprises thermally conductive plastic, ceramic, or metal. ### Claim 14 (depends on 13) The device according to claim 13, wherein a dielectric constant of the thermally conductive material is less than or equal to 8, wherein a loss angle of the thermally conductive material is less than or equal to 0.01, and wherein a coefficient of thermal conductivity of the thermally conductive material is greater than or equal to 1 W/(m*K). ### Claim 15 (depends on 1) The device according to claim 1, wherein a processor is further disposed on the first PCB. ### Claim 16 (depends on 1) The device according to claim 1, wherein the speaker box comprises a speaker. ### Claim 17 (depends on 1) The device according to claim 1, wherein the heat dissipating layer is formed by graphite.