# US 11,122,709 B2 · Electronic device

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- Number: US 11,122,709 B2
- Document ID: US11122709B2
- Status: Granted
- Kind: B2
- Application number: 16/656,427
- Filed: 2019-10-17
- Published: 2020-02-13
- Granted: 2021-09-14
- Earliest claimed: 2017-03-16
- Assignees: Kioxia Corporation
- Applicants: Kioxia Corporation
- Inventors: Akitoshi Suzuki
- Web page: https://patentgrep.com/patent/US11122709B2

## CPC

- H05K 7/20436: {Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 5/006: {characterized by features for holding the PCB within the housing}
- H05K 5/13: assembled by screws
- H05K 7/20136: {Forced ventilation, e.g. by fans (H05K7/202 takes precedence)}
- H05K 7/20472: {Sheet interfaces}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H05K 1/181: associated with surface mounted components
- H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10159: Memory
- H05K 2201/10189: Non-printed connector
- H05K 2201/10409: Screws
- H05K 2201/10424: Frame holders
- H05K 2201/10522: Adjacent components
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

## Claims

### Claim 1

An electronic device comprising:
a top plate having opposing first and second edges, opposing third and fourth edges that are perpendicular to the first and the second edges, a first portion with a first upper surface formed at an interior portion of the top plate and along the first, second, and fourth edges, and a second portion with a second upper surface at an elevation that is lower than an elevation of the first upper surface, the second upper surface being formed along an entire third edge of the top plate and to extend from the first edge of the top plate to the second edge of the top plate, the top plate further including at least one screw hole formed on the second portion;
a bottom plate provided under the top plate; and
a circuit board placed between the top plate and the bottom plate and mounted with an electronic component,
wherein the top plate further includes a rib on the first portion and a plurality of recessed portions formed on the rib, and
wherein the rib is at an elevation that is lower than the elevation of the first upper surface, and each of the plurality of recessed portions is at an elevation that is lower than the elevation of the rib.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein
the top plate has a rectangular shape and the first and second edges are short edges of the rectangular shape.

### Claim 3 (depends on 2)

The electronic device according to claim 2, wherein
the third and fourth edges are long edges of the rectangular shape.

### Claim 4 (depends on 1)

The electronic device according to claim 1, wherein
the first upper surface and the second upper surface form a step.

### Claim 5 (depends on 1)

The electronic device according to claim 1, further comprising
a plurality of heat dissipation sheets between the circuit board and one or both of the top plate and the bottom plate.

### Claim 6 (depends on 5)

The electronic device according to claim 5, wherein
the heat dissipation sheets contact the top plate and the circuit board.

### Claim 7 (depends on 5)

The electronic device according to claim 5, wherein
the heat dissipation sheets contact the bottom plate and the circuit board.

### Claim 8 (depends on 1)

The electronic device according to claim 1, wherein
a height from the bottom plate to the first upper surface conforms to Small Form Factor (SFF) standard.

### Claim 9 (depends on 8)

The electronic device according to claim 8, further comprising:
a screw inserted through the screw hole, wherein
a head of the screw does not project higher than the first upper surface.