# US 11,122,707 B2 · Raised pathway heat sink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,707 B2 - Document ID: US11122707B2 - Status: Granted - Kind: B2 - Application number: 16/506,938 - Filed: 2019-07-09 - Published: 2020-01-16 - Granted: 2021-09-14 - Earliest claimed: 2018-07-12 - Assignees: ARRIS Enterprises LLC - Applicants: ARRIS Enterprises LLC - Inventors: Justin Diep; Chien-Cheng Huang; John Hausman; Hai Lin - Web page: https://patentgrep.com/patent/US11122707B2 ## CPC - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - H04B 1/08: Constructional details, e.g. cabinet - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring} - H05K 7/1427: {Housings} - H05K 9/0022: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)} - H05K 9/006: {specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier} - H01Q 1/12: Supports; Mounting means - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H04B: TRANSMISSION - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board. ## Claims ### Claim 1 A heat sink apparatus comprising: a main surface configured to be housed within a housing, said housing including an upper cover and a lower cover; and one or more raised covered pathways defined by the main surface that include at least one antenna cable therethrough, wherein the one or more raised covered pathways extend upward in a direction toward the upper cover of the housing; wherein upon securing the heat sink apparatus to the lower cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink apparatus and the housing. ### Claim 2 (depends on 1) The heat sink apparatus of claim 1, wherein the heat sink apparatus provides noise isolation. ### Claim 3 (depends on 1) The heat sink apparatus of claim 1, wherein the main surface provides heat transfer between the heat sink apparatus and the housing. ### Claim 4 (depends on 1) The heat sink apparatus of claim 1, wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to an inner surface of the lower cover. ### Claim 5 (depends on 1) The heat sink apparatus of claim 1, wherein the heat sink apparatus is formed of aluminum. ### Claim 6 (depends on 1) The heat sink apparatus of claim 1, wherein the plurality of raised covered pathways includes at least (i) a first portion that begins at a first edge of the heat sink apparatus and extends inward therefrom, (ii) a second portion that extends from the first portion towards a second edge of the heat sink apparatus, (iii) a third portion that extends along the second edge of the heat sink apparatus, (iv) a fourth portion that extends inward from the second edge of the heat sink towards a fourth edge of the heat sink apparatus, and (v) a fifth portion that extends from the fourth portion towards a third edge of the heat sink apparatus. ### Claim 7 A device comprising: a housing including an upper cover and a lower cover, wherein said upper cover and said lower cover are configured to be secured together; and a heat sink having a main surface configured to be housed within the housing, wherein the main surface of the heat sink defines one or more raised covered pathways that include at least one antenna cable therethrough, wherein the one or more raised covered pathways extend upward in a direction toward the upper cover of the housing and, wherein upon securing the heat sink to the lower cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing. ### Claim 8 (depends on 7) The device of claim 7, wherein the heat sink provides noise isolation. ### Claim 9 (depends on 7) The device of claim 7, wherein the heat sink provides heat transfer to the housing. ### Claim 10 (depends on 7) The device of claim 7, wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to an inner surface of the lower cover. ### Claim 11 (depends on 7) The device of claim 7, wherein the heat sink is formed of aluminum. ### Claim 12 A wireless electronic device comprising: a housing formed of an upper cover and a lower cover, wherein said upper cover and said lower cover and configured to be secured together; a printed circuit board with a plurality of components mounted thereto including at least one integrated circuit; at least one wireless antenna, wherein the at least one wireless antenna includes at least one antenna cable; and a heat sink having a main surface configured to be secured proximate to an inner surface of the lower cover of the housing, wherein the main surface of the heat sink defines one or more raised covered pathways therein that are dimensioned to house the at least one antenna cable therethrough, and wherein the one or more raised covered pathways extend upward in a direction toward the upper cover of the housing, wherein upon securing the heat sink to the lower cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing, and wherein the one or more tunnels route the at least one antenna cable. ### Claim 13 (depends on 12) The device of claim 12, wherein the one or more tunnels provide noise isolation for the at least one antenna cable. ### Claim 14 (depends on 12) The device of claim 12, wherein the heat sink extracts heat generated from the printed circuit board and transfers at least some of the extracted heat to the housing. ### Claim 15 (depends on 12) The device of claim 12, wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to the inner surface of the lower cover. ### Claim 16 (depends on 12) The device of claim 12, wherein the one or more raised covered pathways are configured so as to not interfere with the plurality of components on the printed circuit board or any other components within the housing. ### Claim 17 (depends on 12) The device of claim 12, wherein the heat sink is formed of aluminum.