# US 11,122,704 B2 · Liquid submersion cooled electronic systems and devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,704 B2 - Document ID: US11122704B2 - Status: Granted - Kind: B2 - Application number: 16/685,233 - Filed: 2019-11-15 - Published: 2020-04-02 - Granted: 2021-09-14 - Earliest claimed: 2018-09-28 - Assignees: Liquidcool Solutions, Inc. - Applicants: LiquidCool Solutions, Inc. - Inventors: Sean Michael Archer; Steve Shafer; David Roe; Lyle Rick Tufty - Web page: https://patentgrep.com/patent/US11122704B2 ## CPC - H05K 7/20236: {by immersion} - F28D 1/0206: {Heat exchangers immersed in a large body of liquid (apparatus using liquid heat storage material F28D20/0034)} - G06F 1/20: Cooling means - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/20763: {Liquid cooling without phase change} - H05K 7/20772: {within server blades for removing heat from heat source} - G06F 2200/201: Cooling arrangements using cooling fluid - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing. ## Claims ### Claim 1 An electronic system, comprising: a rack and a plurality of liquid submersion cooled electronic devices on the rack; each one of the liquid submersion cooled electronic devices includes: a liquid tight tray having a bottom wall and side walls defining an interior space, and an at least partially open top opposite the bottom wall; a removable cover over the at least partially open top; at least one heat generating electronic component disposed within the interior space; a single phase dielectric cooling liquid in the interior space, the single phase dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component; a pump having a pump inlet in fluid communication with the interior space and a pump outlet; a pressure relief/equalization device in the removable cover which provides air communication between the interior space and ambient environment such that pressure in the interior space equals the ambient pressure; and a plurality of heat exchangers, each one of the heat exchangers is associated with and is fluidly connected to a corresponding single one of the liquid submersion cooled electronic devices, each heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet of the pump in the corresponding liquid submersion cooled electronic device and having a heat exchanger outlet in fluid communication with the interior space of the corresponding liquid submersion cooled electronic device; a secondary cooling fluid loop in fluid communication with each one of the heat exchangers that supplies a secondary cooling liquid to each heat exchanger; the plurality of liquid submersion cooled electronic devices are disposed in a vertical array on the rack. ### Claim 2 (depends on 1) The electronic system of claim 1, wherein for each one of the liquid submersion cooled electronic devices, the heat exchanger is disposed within the interior space. ### Claim 3 (depends on 1) The electronic system of claim 1, wherein for each one of the liquid submersion cooled electronic devices, the heat exchanger is disposed outside of the liquid tight tray. ### Claim 4 (depends on 1) The electronic system of claim 1, wherein for each one of the liquid submersion cooled electronic devices, the pump and the heat exchanger are disposed at a first end of the liquid tight tray. ### Claim 5 (depends on 1) The electronic system of claim 1, wherein for each one of the liquid submersion cooled electronic devices the at least one heat generating electronic component comprises a plurality of heat generating electronic components within the interior space, and wherein the plurality of heat generating electronic components comprise a plurality of data storage devices, a plurality of power supplies, a plurality of processors, or a plurality of switches. ### Claim 6 A liquid submersion cooled electronic device, comprising: a liquid tight tray having a horizontal bottom wall and vertical side walls defining an interior space, an at least partially open top opposite the horizontal bottom wall, and a horizontal cover removably attached to the liquid tight tray and disposed over the at least partially open top, the horizontal cover is not sealed with the liquid tight tray; a pressure relief/equalization device in the horizontal cover which provides air communication between the interior space and ambient environment wherein pressure in the interior space equals ambient pressure; at least one heat generating electronic component disposed within the interior space; a single phase dielectric cooling liquid in the interior space, the single phase dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component; a pump having a pump inlet in fluid communication with the interior space and a pump outlet; a heat exchanger disposed within the interior space or mounted on one of the vertical side walls outside the interior space, the heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet, and a heat exchanger outlet in fluid communication with the interior space; and the heat exchanger is configured to be in fluid communication with a secondary cooling fluid loop that supplies a secondary cooling liquid to the heat exchanger. ### Claim 7 (depends on 6) The liquid submersion cooled electronic device of claim 6, wherein the pump is disposed within the interior space and the pump inlet is submerged in the single phase dielectric cooling liquid. ### Claim 8 (depends on 6) The liquid submersion cooled electronic device of claim 6, wherein the pump and the heat exchanger are disposed at a first end of the liquid tight tray. ### Claim 9 (depends on 6) The liquid submersion cooled electronic device of claim 6, wherein the at least one heat generating electronic component comprises a plurality of heat generating electronic components within the interior space, and wherein the plurality of heat generating electronic components comprise a plurality of data storage devices, a plurality of power supplies, a plurality of processors, or a plurality of switches. ### Claim 10 (depends on 6) A liquid submersion cooled electronic system, comprising: a plurality of liquid submersion cooled electronic devices of claim 6 disposed in a vertical array on a rack.