# US 11,122,694 B2 · Printed circuit board and package having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,122,694 B2 - Document ID: US11122694B2 - Status: Granted - Kind: B2 - Application number: 16/676,493 - Filed: 2019-11-07 - Published: 2020-06-04 - Granted: 2021-09-14 - Earliest claimed: 2018-12-04 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Tae-Hong Min; Ju-Ho Kim - Web page: https://patentgrep.com/patent/US11122694B2 ## CPC - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H01Q 1/243: {with built-in antennas} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 21/065: {Patch antenna array} - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} - H04M 1/0277: {for a printed circuit board assembly} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/165: {incorporating printed inductors} - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/0187: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) ## Abstract A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate. ## Claims ### Claim 1 A printed circuit board comprising: a laminate comprising stacked insulating layers including a rigid insulating layer; a first flexible insulating layer comprising a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; a second flexible insulating layer disposed in the laminate, wherein the first flexible insulating layer and the second flexible insulating layer are on different planes and extend outside the laminate in different directions; and a first antenna disposed on a surface of the laminate. ### Claim 2 (depends on 1) The printed circuit board of claim 1, further comprising a second antenna disposed in the laminate and overlapping the first antenna. ### Claim 3 (depends on 1) The printed circuit board of claim 1, further comprising an additional antenna disposed in the laminate, wherein the additional antenna is of a different type from the first antenna. ### Claim 4 (depends on 1) The printed circuit board of claim 1, wherein the second flexible insulating layer comprises a partial region disposed inside the laminate and a remaining region disposed outside of the laminate. ### Claim 5 (depends on 4) The printed circuit board of claim 4, further comprising a circuit pattern disposed at an end of the remaining region of the first flexible insulating layer; and an additional antenna disposed at an end of the remaining region of the second flexible insulating layer. ### Claim 6 (depends on 4) The printed circuit board of claim 4, wherein the first flexible insulating layer and the second flexible insulating layer extend outside the laminate in a same direction. ### Claim 7 (depends on 4) The printed circuit board of claim 4, wherein the first flexible insulating layer and the second flexible insulating layer comprise a plurality of layers, respectively. ### Claim 8 (depends on 1) The printed circuit board of claim 1, wherein the rigid insulating layer comprises: a first rigid insulating layer; and a second rigid insulating layer disposed on both sides of the first rigid insulating layer, and the first rigid insulating layer is thicker than the second rigid insulating layer. ### Claim 9 (depends on 8) The printed circuit board of claim 8, wherein the first antenna and the first flexible insulating layer are disposed on opposite sides of the first rigid insulating layer. ### Claim 10 (depends on 1) The printed circuit board of claim 1, further comprising a solder resist layer stacked on at least one side of the laminate. ### Claim 11 (depends on 10) The printed circuit board of claim 10, wherein the first flexible insulating layer is in contact with the solder resist layer. ### Claim 12 (depends on 1) The printed circuit board of claim 1, wherein the first flexible insulating layer comprises one or both of an insulating layer comprising a liquid crystal polymer (LCP) and an insulating layer comprising a polyphenylene ether (PPE). ### Claim 13 A printed circuit board comprising: a laminate comprising stacked insulating layers including a rigid insulating layer; a first flexible insulating layer comprising a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; a second flexible insulating layer comprising a partial region disposed inside the laminate and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate, wherein the first flexible insulating layer and the second flexible insulating layer are different layers, and at least one of the insulating layers is interposed between the first flexible insulating layer and the second flexible insulating layer. ### Claim 14 A printed circuit board comprising: a laminate comprising stacked insulating layers including a rigid insulating layer, the rigid insulating layer comprising a first rigid insulating layer and a second rigid insulating layer disposed on both sides of the first rigid insulating layer, wherein the first rigid insulating layer is thicker than the second rigid insulating layer; a flexible insulating layer comprising a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; a first antenna disposed on a surface of the laminate; and a second antenna disposed in the laminate and overlapping the first antenna, wherein the second antenna is disposed on a surface of the first rigid insulating layer.